|
Letms
|
Requirements
|
Methods
|
|
Temperature
characteristic
|
±25、50、100×10-6/℃
|
-55℃
~
150℃
|
|
Life
|
±(1%R+0.05Ω)
|
70±
5℃
、VR(or
Umax)
1000h
|
|
Dielectric
withstand voltage
|
no
breakdown or flashover
±(0.5%R+0.05Ω)
|
V-block
1min
|
250V
|
RJ23
|
|
350V
|
RJ24
|
|
500V
|
RJ25
|
|
Solderability
|
A
new uniform coating of solder shall cover
a minimum of 95% of the surface being
immersed.
|
245±
5℃
5±0.5s
|
|
Over-load
|
No
visible damage,legible
marking
(0.5%R+0.05Ω)
|
2.5VR(or
2Umax)5s
|
|
Terminal
strength
|
±(0.2%R+0.05Ω)
|
tensile:(5N
or 10N)
torsion
360°
3次
|
|
Resistance
to soldering heat
|
±(0.5%R+0.05Ω)
|
350±
10℃
3+0.50s
from
component body:3+
0.50mm
|
|
Thermal
shock
|
±(0.5%R+0.05Ω)
|
-65/
150℃
5
circulation
|
|
Operation
at low temperature
|
±(0.5%R+0.05Ω)
|
-65℃
、VR(or
Umax)
45min
|
|
High
frequency vibration
|
±(0.5%R+0.05Ω)
|
10~2000HZ,
0.75mm
147m
/s2 8h
|
|
Mositure
proof
|
±(1.5%R+0.05Ω)
|
RH:80~90%,-10~
65℃
24h (VR or Umax.4h) 10
circulation
|
|
Resistance
to solution
|
No
visible damage,legible
marking
|
Immersing
1 minute in solvent specified
brush 10 time, totally 3
Circulation
|